Robust & High Precision Solutions
At ECS, we are constantly rising our benchmarks and standards to cater to a versatile clientele. Our rich expertise in planning & developing military-grade products have enabled us to innovate in every expect.

RF Technology
We use unique, custom-built tools to give us the edge
Our Goal is to manufacture communication systems that are cater to frequencies upto 18GHz, while our current product line caters to upto 6GHz.
Our Facilities have highly specialised clean-rooms to handle microwave and RF based products to adhere to the standards set by the environmental facilities on premises. We are equipped in-house to manufacture cable assemblies and perform Integration Tests end-to-end. We are working towards acquiring RF design and Simulation packages. With keeping in view of the Antenna development requirements we are augmenting our facilities to make communication antennas as well as broad band Antennas for Radar and EW applications.
PCB
We use unique, custom-built tools to give us the edge
We are one of the leading industries, registered for supplying of MIL Qualified PCBs under Rate Contract for Aerospace and Defence sectors.

PCB Design Services
- PCB Designing – Single, Double & Multi-Layer (up to 30 layers) Boards
- Rigid, Flex & Rigid-Flex Board Designs
- Parts Decal Creation and Library Services
- High Speed, High Layer count Ultra High-density PCB layout design
- Floor Planning for Hybrid Boards
- Stack-Up Design & Power Planes Management
- Impedance Controlled Routing with Length (Delay) Matching, Differential Shielded lines
- PCB Layout Design with Micro Vias, Blind Vias, Buried Vias, and back drill
- Designs with multiple Fine Pitch BGA of high pin count
- 3D Modelling of the PCB to assist in the Mechanical Enclosure design
- Design for Manufacturability (DFM)
- Design for Testability (DFT)
- Design for Serviceability (DFS)
- Dedicated team for customer-specific or Standards compliant Library
development and management which include schematic symbols, PCB
footprint, and 3D models
Signal Integrity
- Signal Integrity analysis
- Thermal Analysis
- Power Integrity Analysis
- DDR System Analysis
- Cross-Talk Analysis
- Study of Overshoot, Undershoot, Reflections and Termination Analysis
- Board Level EMI/EMC Analysis

ASSEMBLY & CABLE HARNESS
We use unique, custom-built tools to give us the edge
Our products adhere to the stringent IPC610, IPC620 soldering and cable harness standards. The facilities are environmentally controlled and dust proof with ESD Technology. We propose to augment our manufacturing facilities with SMT assembly, BGA Rework Station etc.
Facilities
- Baking Ovens
- Anti-static bins
- De-humidification chamber
- SMT Line
- AOI
- Manual Soldering Stations
- Cable Harness Work Area
- Class 100000 Clean Room Facility
- Conformal Coating Work Area
Services
- PCB Assembly – SMD and Through Hole components
- Flexi PCB Assembly
- RF Cards Assembly
- Relay Wiring
- Potting and Conformal Coating
- Cable Harness
Electronics / Electrical Design
We use unique, custom-built tools to give us the edge
Capabilities
Analog Sensor signal conditioning & Interface design
Analog and mixed-signal circuits design
Low-Level Sensor Interfacing (Pressure, Thermocouples, Strain Gauges, RTD, Vibration)
Interfacing High speed Analog to Digital and Digital to Analog converters RF Technology - High Speed Design.
Serial/Network Communication using: Ethernet, CAN, RS-232/422/485, SPI, I2C, UART, USB, MIL-STD-1553 - Power supply design.


Software Design
We use unique, custom-built tools to give us the edge
Capabilities
Code Development for FPGAs & CPLDs
Firmware Development for Embedded Systems
Device Drivers
Firmware Development for Microcontrollers and FPGAs for Embedded Systems
Graphical User Interface Development for PC based applications
FPGA & Embedded Controllers
We use unique, custom-built tools to give us the edge
We offer embedded design services, that include Multi Gate FPGA (Field Programmable Gate Arrays), Vertex Series, Xilinx Series and micro controller based design and development. Our services are offered as part of full products development or as standalone service, to revolutionise the field of digital and embedded circuit design by introducing programmable architecture, high speed and high density at a relatively low cost.
8, 16, 32 and 64-Bit Microcontrollers
- Si LABS
- Microchip
- AVR
- NXP
- AOI
- STM 32
- iMx6 processor
Micro semi (ACTEL) and Xilinx
- IGLOO Series FPGAs
- Smart Fusion FPGA
- SPARTEN 6 and KINTEX Series FPGAs
- VIRTEX FPGA
- ZYNQ SOC FPGA

Validation & Testing
We use unique, custom-built tools to give us the edge
We offer embedded design services, that include Multi Gate FPGA (Field Programmable Gate Arrays), Vertex Series, Xilinx Series and micro controller based design and development. Our services are offered as part of full products development or as standalone service, to revolutionise the field of digital and embedded circuit design by introducing programmable architecture, high speed and high density at a relatively low cost.
- Code Walkthrough
- IV& V Test Documents
- Functional and Structural Testing
- Test cases and Test Reports preparation
- Testing process for Integration Testing

Mechanical Design
We use unique, custom-built tools to give us the edge
We at ECS, undertake mechanical design and fabrication of products to meet and exceed the industry standards of Aerospace, Defence, Naval sectors. Our Mechanical Engineering Designing team is supported with high-end design softwares like Creo and AutoCAD with precision machines to deliver the works with quick turnaround time. Our mechanical team is trained and certified to design high precision jobs and deliver them as to meet the customer’s requirements and make them satisfy.
Services
- Mechanical enclosures Design & Fabrication
- Design & fabrication of Fixtures and Test Jigs
- 3D Designing for both Part and Assembly Modeling
- Preparation of 2D Drawings with Parent Child Concept
Structural & Stress Analysis
- Random vibration
- Sine vibration
- Dynamic analysis
Thermal Analysis
- Heat sink design based on heat dissipation
- Chassis level includes integrated module Thermal Analysis